STELLAR THERMAL PERFORMANCE
Enjoy better system performance by keeping things cool with up to 220W of heat dissipation power featuring four direct touch heat pipes that rapidly draw heat away from the CPU.
FAN LOCK MOUNTING SYSTEM
When installing the AG400, the fan does not need to be disassembled during the process, simplifying and saving time.
The AG400 maintains excellent hardware compatibility with its compact design for 100% RAM clearance and has a slight offset for quick and easy installation. Its superb thermal performance also allows it to be compatible with demanding processing workloads.
BALANCED BIDIRECTIONAL HEAT PIPE TECHNOLOGY
By optimizing the internal capillary structure and injecting a precise amount of liquid, the heat pipe achieves the best heat dissipation performance regardless of whether the cooler is in a vertical or horizontal case. This perfect ratio facilitates a highly efficient phase change throughout the heat pipe and achieves lower thermal resistance over a wide TDP range.
MATRIX FINS ARRAY
High-quality aluminium fins on the heat sink are densely stacked for ideal heat dissipation and which also features a unique “checkerboard” design aesthetic.
SIMPLE AND SECURE
The included mounting brackets support both Intel and AMD platforms with an easy five-step installation process that maintains great contact pressure. The offset design of the heat pipes ensures that the cooler can be installed with the fan already attached.
Intel: LGA1700 / 1200 / 1151 / 1150 / 1155
AMD: AM5 / AM4
125 x 92 x 150 mm
120 x 92 x 150 mm