Description
On-die ECC (ODECC) helps maintain data integrity to sustain the ultimate performance while you push the limits!
Increased efficiency
Boosted by double the banks and burst length and two independent 32-bit subchannels, DDR5’s exceptional handling of data shines with the latest games, programs and demanding applications.
Intel® XMP 3.0 certified
Advanced pre-optimised timings, speed and voltage for overclocking performance and save new user-customisable profiles using a programmable PMIC.
AMD EXPO certified
AMD EXPO (Extended Profiles for Overclocking) Certified modules include Intel XMP 3.0 profiles, enabling compatibility with the platform of your choice.
Qualified by the world’s leading motherboard manufacturers*
Tested and approved so you can build and upgrade with confidence on your preferred motherboard.
Low-profile heat spreader
Newly designed heat spreaders in black or white combine bold styling and outstanding cooling functionality.
Specifications
| Power | |
|---|---|
| Memory voltage | 1.25 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 5600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 – 85 °C |
| Storage temperature (T-T) | -55 – 100 °C |
| Weight & dimensions | |
| Package width | 95.2 mm |
| Package depth | 14 mm |
| Package height | 171.4 mm |
| Width | 6.62 mm |
| Depth | 133.3 mm |
| Height | 34.9 mm |
| Weight | 66.08 g |
| Package weight | 101.72 g |
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